US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,498, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Chajea Jo (Suwon-si, South Korea), Dohyun Kim (Suwon-si, South Korea) and Seungryong Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate; a first chip structure on the substrate and having a first thickness in a first direction; a second chip structure on the substrate adjacent to the first chip structure along a second direction and having a second thickness in the first direction; a third chip structure on the substrate and adjacent to the first chip ...