US Patent Issued to FUJI ELECTRIC on July 21 for "Semiconductor module" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,497, issued on July 21, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan).

"Semiconductor module" was invented by Hiroyuki Nogawa (Matsumoto-city, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes at least, a conductive pattern on the insulating substrate; a first semiconductor element on the conductive pattern, a second semiconductor element on the conductive pattern, a first power collecting portion connected to a first output electrode of the first semiconductor element with a first line; and a second power collecting portion connected to a second output electrode of the second semiconductor element with ...