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US Patent Issued to Applied Materials on July 21 for "Forming mesas on an electrostatic chuck" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,419, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Forming mesas on an electrostatic chuck" was invente... Read More


US Patent Issued to Tokyo Ohka Kogyo on July 21 for "Semiconductor device production method" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,420, issued on July 21, was assigned to Tokyo Ohka Kogyo Co. Ltd. (Kawasaki, Japan). "Semiconductor device production method" was invented ... Read More


US Patent Issued to Persimmon Technologies on July 21 for "Material-handling robot trajectory control" (Massachusetts Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,421, issued on July 21, was assigned to Persimmon Technologies Corp. (Wakefield, Mass.). "Material-handling robot trajectory control" was i... Read More


US Patent Issued to GLOBALWAFERS on July 21 for "Wafer carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,422, issued on July 21, was assigned to GLOBALWAFERS Co. LTD. (Hsinchu City, Taiwan). "Wafer carrier" was invented by Chih-Yuan Chuang (Hsi... Read More


US Patent Issued to ERS ELECTRONIC on July 21 for "Shielding device for a chuck, corresponding chuck, and corresponding wafer prober assembly" (German Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,423, issued on July 21, was assigned to ERS ELECTRONIC GMBH (Germering, Germany). "Shielding device for a chuck, corresponding chuck, and c... Read More


US Patent Issued to SEMES on July 21 for "Lift pin assembly and substrate processing apparatus having same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,424, issued on July 21, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Lift pin assembly and substrate processing apparatus hav... Read More


US Patent Issued to PROTEANTECS on July 21 for "Die-to-die connectivity monitoring with a clocked receiver" (Israeli Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,425, issued on July 21, was assigned to PROTEANTECS LTD. (Haifa, Israel). "Die-to-die connectivity monitoring with a clocked receiver" was ... Read More


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Semiconductor structure for detecting vertical electrical leakage" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,426, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure for detecting vertical e... Read More


US Patent Issued to Semes on July 21 for "Sensor station, data acquisition method and substrate treating system" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,427, issued on July 21, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea). "Sensor station, data acquisition method and subst... Read More


US Patent Issued to Oxford Instruments Nanotechnology Tools on July 21 for "Method of preparing a silicon carbide wafer" (British Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,428, issued on July 21, was assigned to Oxford Instruments Nanotechnology Tools Ltd. (High Wycombe, Great Britain). "Method of preparing a ... Read More