US Patent Issued to Kyushu University National University, Gigaphoton on July 21 for "Machine learning method, laser annealing system, and laser annealing method" (Japanese Inventors)

Posted On: 2026-07-21

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,409, issued on July 21, was assigned to Kyushu University National University Corp. (Fukuoka, Japan) and Gigaphoton Inc. (Tochigi, Japan). ... Read More

US Patent Issued to Applied Materials on July 21 for "Semiconductor processing tool platform configuration with reduced footprint" (California, Texas Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,410, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor processing tool platform configuration... Read More

US Patent Issued to Applied Materials on July 21 for "Methods and apparatus for processing a substrate" (Indian, American Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,411, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and apparatus for processing a substrate" wa... Read More

US Patent Issued to International Business Machines on July 21 for "Verifying alignment of multiple die on a substrate" (New York, Vermont, Connecticut Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,412, issued on July 21, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Verifying alignment of multiple die on a sub... Read More

US Patent Issued to Applied Materials on July 21 for "Large format continuous imaging system" (California Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,413, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Large format continuous imaging system" was invented... Read More

US Patent Issued to Tokyo Electron on July 21 for "Substrate holder, substrate processing system, and substrate transfer method" (Japanese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,414, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate holder, substrate processing system, and substrate transfer... Read More

US Patent Issued to GSEC GERMAN SEMICONDUCTOR EQUIPMENT on July 21 for "Device and method for handling pot-shaped hollow bodies, more particularly transport containers for semiconductor wafers or EUV lithography masks" (German, Swiss Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,415, issued on July 21, was assigned to GSEC GERMAN SEMICONDUCTOR EQUIPMENT COMPANY GMBH (Furtwangen, Germany). "Device and method for hand... Read More

US Patent Issued to SCREEN Holdings on July 21 for "Substrate processing method" (Japanese Inventor)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,416, issued on July 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method" was invented by Tomohiro Tak... Read More

US Patent Issued to NGK INSULATORS on July 21 for "Wafer placement table" (Japanese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,417, issued on July 21, was assigned to NGK INSULATORS Ltd. (Nagoya-City, Japan). "Wafer placement table" was invented by Seiya Inoue (Hand... Read More

US Patent Issued to Applied Materials on July 21 for "Apparatus for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films" (California, Oregon Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,418, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus for clamping a substrate on a mono-polar e... Read More

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US Patent Issued to Kyushu University National University, Gigaphoton on July 21 for "Machine learning method, laser annealing system, and laser annealing method" (Japanese Inventors)

US Patent Issued to Applied Materials on July 21 for "Semiconductor processing tool platform configuration with reduced footprint" (California, Texas Inventors)

US Patent Issued to Applied Materials on July 21 for "Methods and apparatus for processing a substrate" (Indian, American Inventors)

US Patent Issued to International Business Machines on July 21 for "Verifying alignment of multiple die on a substrate" (New York, Vermont, Connecticut Inventors)

US Patent Issued to Applied Materials on July 21 for "Large format continuous imaging system" (California Inventors)

US Patent Issued to Tokyo Electron on July 21 for "Substrate holder, substrate processing system, and substrate transfer method" (Japanese Inventors)

US Patent Issued to GSEC GERMAN SEMICONDUCTOR EQUIPMENT on July 21 for "Device and method for handling pot-shaped hollow bodies, more particularly transport containers for semiconductor wafers or EUV lithography masks" (German, Swiss Inventors)

US Patent Issued to SCREEN Holdings on July 21 for "Substrate processing method" (Japanese Inventor)

US Patent Issued to NGK INSULATORS on July 21 for "Wafer placement table" (Japanese Inventors)

US Patent Issued to Applied Materials on July 21 for "Apparatus for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films" (California, Oregon Inventors)