US Patent Issued to GSEC GERMAN SEMICONDUCTOR EQUIPMENT on July 21 for "Device and method for handling pot-shaped hollow bodies, more particularly transport containers for semiconductor wafers or EUV lithography masks" (German, Swiss Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,415, issued on July 21, was assigned to GSEC GERMAN SEMICONDUCTOR EQUIPMENT COMPANY GMBH (Furtwangen, Germany).

"Device and method for handling pot-shaped hollow bodies, more particularly transport containers for semiconductor wafers or EUV lithography masks" was invented by Gunter Haas (St. Georgen, Germany), Jurgen Gutekunst (Steckborn, Switzerland) and Frank Schienle (Freiburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device for handling pot-shaped hollow bodies, more particularly transport containers for semiconductor wafers or for EUV lithography masks includes a wall, which encloses an inner space, a gripping and moving apparat...