US Patent Issued to International Business Machines on July 21 for "Verifying alignment of multiple die on a substrate" (New York, Vermont, Connecticut Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,412, issued on July 21, was assigned to International Business Machines Corp. (Armonk, N.Y.).

"Verifying alignment of multiple die on a substrate" was invented by Monali Naresh Basutkar (Danbury, Conn.), Christopher Muzzy (Burlington, Vt.), Steven Paul Ostrander (Poughkeepsie, N.Y.), Thomas Weiss (Poughkeepsie, N.Y.), Thomas Anthony Wassick (LaGrangeville, N.Y.), Brian W. Quinlan (Poughkeepsie, N.Y.) and Kurt Alan Smith (Pleasant Valley, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A top-down inspection system and method employs a strategy using specific geometric shaped metal alignment markers on a semiconductor die and a laminate that can b...