ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,431, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "High aspect ratio carbon layer etch with improved throughput and proces... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,432, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treating method and substrate treating apparatus"... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,433, issued on May 19, was assigned to ams-OSRAM International GmbH (Regensburg, Germany). "Method for producing a substrate having a struct... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,434, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "High aspect ratio contact etching with additive gas" was invented by Du... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,435, issued on May 19, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Ruthenium carbide for DRAM capacitor mold patterning" ... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,436, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing method and plasma processing system" was invented by ... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,437, issued on May 19, was assigned to DISCO Corp. (Tokyo). "Method of processing wafer using support substrate and joint member" was invent... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,438, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Offset data correction method and semiconducto... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,439, issued on May 19, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Process for manufacturing a silicon carbide semic... Read More
ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,440, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor processing tool and met... Read More