US Patent Issued to SCREEN Holdings on May 19 for "Substrate treating method and substrate treating apparatus" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,432, issued on May 19, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate treating method and substrate treating apparatus" was invented by Dai Ueda (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to a substrate treating method and a substrate treating apparatus. The substrate treating method for treating a substrate W includes a switching step and a processing step. In the switching step, an additive agent is switched between an anion surfactant and a cation surfactant. In the processing step, an etching solution is supplied to the substrate W. In the processing step, the additive agent selected ...