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US Patent Issued to Applied Materials on July 21 for "Symmetric antenna arrays for high density plasma enhanced process chamber" (South Korean, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,688,999, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Symmetric antenna arrays for high density plasma enh... Read More


US Patent Issued to Semes on July 21 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,000, issued on July 21, was assigned to Semes Co. Ltd. (Cheonan-si, South Korea). "Substrate processing apparatus" was invented by Sangjeon... Read More


US Patent Issued to Tokyo Electron on July 21 for "Plasma potential adjustment circuit" (American, Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,001, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma potential adjustment circuit" was invented by Qiang Wang (Aust... Read More


US Patent Issued to Tokyo Electron on July 21 for "Plasma processing apparatus, power source system, and plasma processing method" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,002, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Plasma processing apparatus, power source system, and plasma processi... Read More


US Patent Issued to Tokyo Electron on July 21 for "Film deposition apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,003, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Film deposition apparatus" was invented by Taehoon Park (Gyeonggi-do,... Read More


US Patent Issued to Tokyo Electron, The University of Shiga Prefecture on July 21 for "Plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,004, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo) and The University of Shiga Prefecture (Shiga, Japan). "Plasma processi... Read More


US Patent Issued to WONIK IPS on July 21 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,005, issued on July 21, was assigned to WONIK IPS Co. LTD. (Pyeongtaek-si, South Korea). "Substrate processing apparatus" was invented by Y... Read More


US Patent Issued to Tokyo Electron on July 21 for "Etching method and plasma processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,006, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching method and plasma processing apparatus" was invented by Takas... Read More


US Patent Issued to TOTO on July 21 for "Structural member" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,007, issued on July 21, was assigned to TOTO Ltd. (Fukuoka, Japan). "Structural member" was invented by Morio Hosokawa (Fukuoka, Japan) and... Read More


US Patent Issued to Tokyo Electron on July 21 for "Substrate transfer system and transfer module" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,009, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate transfer system and transfer module" was invented by Toshia... Read More