ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,003, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film deposition apparatus" was invented by Taehoon Park (Gyeonggi-do, South Korea), Jaihyung Won (Gyeonggi-do, South Korea), Naeil Lee (Gyeonggi-do, South Korea), Jinhyung Park (Gyeonggi-do, South Korea), Choonkum Baik (Gyeonggi-do, South Korea) and Hyonam Lim (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film deposition apparatus includes a reactive gas supply configured to supply a reactive gas to a first chamber; a source gas supply configured to supply a source gas to a second chamber; a first plasma mechanism configured to generate inductively cou...