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US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Semiconductor device package and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,476, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device package and me... Read More


US Patent Issued to SHINKO ELECTRIC INDUSTRIES on July 21 for "Wiring substrate, semiconductor device, and method of manufacturing the wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,477, issued on July 21, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Wiring substrate, semiconductor device, and m... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package having semiconductor chip on wiring layers and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,478, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package having semiconductor c... Read More


US Patent Issued to Proterial on July 21 for "Silicon nitride substrate, silicon nitride circuit substrate, and evaluation method, evaluation device, and evaluation system for silicon nitride substrate and silicon nitride circuit substrate" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,479, issued on July 21, was assigned to Proterial Ltd. (Tokyo). "Silicon nitride substrate, silicon nitride circuit substrate, and evaluati... Read More


US Patent Issued to Rockwell Collins on July 21 for "Method for depositive modification of ball grid array (BGA) components soldered to circuit board" (Iowa Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,480, issued on July 21, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa). "Method for depositive modification of ball grid array ... Read More


US Patent Issued to Infineon Technologies Austria on July 21 for "Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate" (German Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,481, issued on July 21, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Electronic device having a soldered joint bet... Read More


DEPARTMENT OF HOMELAND SECURITY ISSUES RULE: USCIS IMMIGRATION FEES AND RELATED PROCEDURES REQUIRED BY H.R.1 RECONCILIATION BILL; CORRECTION

WASHINGTON, July 21 -- Department Of Homeland Security has issued a rule called: USCIS Immigration Fees and Related Procedures Required by H.R.1 Reconciliation Bill; Correction. The rule was publishe... Read More


US Patent Issued to BOLD on July 21 for "Enhanced entity recognition services for classifying user intents" (Indian, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,688,242, issued on July 21, was assigned to BOLD Ltd. (Hamilton, Bermuda). "Enhanced entity recognition services for classifying user intents" ... Read More


US Patent Issued to TOYOTA JIDOSHA on July 21 for "Information processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,688,243, issued on July 21, was assigned to TOYOTA JIDOSHA K.K. (Toyota, Japan). "Information processing system" was invented by Hiroyasu Yamas... Read More


US Patent Issued to ADP on July 21 for "System and method for using graph theory to rank characteristics" (Brazilian Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,688,244, issued on July 21, was assigned to ADP Inc. (Roseland, N.J.). "System and method for using graph theory to rank characteristics" was i... Read More