US Patent Issued to Rockwell Collins on July 21 for "Method for depositive modification of ball grid array (BGA) components soldered to circuit board" (Iowa Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,480, issued on July 21, was assigned to Rockwell Collins Inc. (Cedar Rapids, Iowa).

"Method for depositive modification of ball grid array (BGA) components soldered to circuit board" was invented by Jason Paulsen (Robins, Iowa), Nathaniel T. Oster (Marion, Iowa), Nathan Van Schaick (Marion, Iowa), Mary L. Detweiler (Williamsburg, Iowa) and Jodee Mae Ross (Cedar Rapids, Iowa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for modifying a ball grid array (BGA) component for attachment to a host circuit board includes exposing a set of contact points, and connective paths between the contact points, on the surface of the BGA component. Connecti...