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US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 21 for "Semiconductor device including through via and method of making" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,446, issued on July 21, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device including ... और पढ़ें


US Patent Issued to TEXAS INSTRUMENTS on July 21 for "Common mode suppression circuit" (Belarusian, American Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,447, issued on July 21, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Common mode suppression circuit" was invented by Siraj Akhtar (Da... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Integrated circuit device and electronic device including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,448, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Integrated circuit device and electronic dev... और पढ़ें


US Patent Issued to Micron Technology on July 21 for "Memory device including source structure having conductive islands of different widths" (Idaho Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,449, issued on July 21, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory device including source structure having conductive ... और पढ़ें


US Patent Issued to Fujian Jinhua Integrated Circuit on July 21 for "Semiconductor device and fabricating method thereof" (Chinese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,450, issued on July 21, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Quanzhou City, China). "Semiconductor device and fabrica... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Interconnection structure and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,451, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Interconnection structure and method for manufac... और पढ़ें


US Patent Issued to NANYA TECHNOLOGY on July 21 for "Semiconductor device with thickening layer and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,452, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with thickening layer and m... और पढ़ें


US Patent Issued to YANGTZE MEMORY TECHNOLOGIES on July 21 for "Staircase structure in three-dimensional memory device and method for forming the same" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,453, issued on July 21, was assigned to YANGTZE MEMORY TECHNOLOGIES Co. LTD. (Wuhan, China). "Staircase structure in three-dimensional memo... और पढ़ें


US Patent Issued to Ampleon Netherlands on July 21 for "Electronic package and device comprising the same" (Dutch Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,454, issued on July 21, was assigned to Ampleon Netherlands B.V. (Nijmegen, Netherlands). "Electronic package and device comprising the sam... और पढ़ें


US Patent Issued to Murata Manufacturing on July 21 for "Semiconductor device, semiconductor module, and system" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,455, issued on July 21, was assigned to Murata Manufacturing Co. Ltd. (Kyoto-fu, Japan). "Semiconductor device, semiconductor module, and s... और पढ़ें