US Patent Issued to Imec vzw on July 21 for "Integrated circuit chips comprising forksheet devices connected with buried power rails" (Belgian Inventors)

Posted On: 2026-07-21

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,261, issued on July 21, was assigned to Imec vzw (Leuven, Belgium). "Integrated circuit chips comprising forksheet devices connected with b... Read More

US Patent Issued to DENSO on July 21 for "Semiconductor device having drive circuit configured to output voltages applied to plurality of gate electrodes" (Japanese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,262, issued on July 21, was assigned to DENSO Corp. (Kariya-city, Japan). "Semiconductor device having drive circuit configured to output v... Read More

US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on July 21 for "Dual p-body dose reverse-conducting (DPD-RC) IGBT structure" (California Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,263, issued on July 21, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto). "Dual p-body dose reverse-conducting (DPD... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "PJ junction device structure in semiconductor device with back side power delivery network (BSPDN) structure" (New York Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,264, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "PJ junction device structure in semiconducto... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Field effect transistor with isolation structure and related method" (Taiwanese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,265, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Field effect transistor with isolat... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Embedded semiconductor region for a latch-up susceptibility improvement" (Taiwanese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,266, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Embedded semiconductor region for a... Read More

US Patent Issued to BOE TECHNOLOGY GROUP on July 21 for "Display substrate having interlayer insulation layer with through hole formed therein, method for manufacturing the same and display panel" (Chinese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,267, issued on July 21, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display substrate having interlayer insulation layer with... Read More

US Patent Issued to TCL China Star Optoelectronics Technology on July 21 for "Array substrates and display panels" (Chinese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,268, issued on July 21, was assigned to TCL China Star Optoelectronics Technology Co. Ltd. (Shenzhen, China). "Array substrates and display... Read More

US Patent Issued to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY on July 21 for "Display panel and display device" (Chinese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,269, issued on July 21, was assigned to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Wuhan, China). "Display panel and display dev... Read More

US Patent Issued to INNOLUX on July 21 for "Electronic display device with horizontal connection electrode connecting power lines in peripheral region" (Taiwanese Inventors)

Posted On: 2026-07-21

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ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,270, issued on July 21, was assigned to INNOLUX Corp. (Miao-Li County, Taiwan). "Electronic display device with horizontal connection elect... Read More

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US Patent Issued to Imec vzw on July 21 for "Integrated circuit chips comprising forksheet devices connected with buried power rails" (Belgian Inventors)

US Patent Issued to DENSO on July 21 for "Semiconductor device having drive circuit configured to output voltages applied to plurality of gate electrodes" (Japanese Inventors)

US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on July 21 for "Dual p-body dose reverse-conducting (DPD-RC) IGBT structure" (California Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "PJ junction device structure in semiconductor device with back side power delivery network (BSPDN) structure" (New York Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Field effect transistor with isolation structure and related method" (Taiwanese Inventors)

US Patent Issued to Taiwan Semiconductor Manufacturing on July 21 for "Embedded semiconductor region for a latch-up susceptibility improvement" (Taiwanese Inventors)

US Patent Issued to BOE TECHNOLOGY GROUP on July 21 for "Display substrate having interlayer insulation layer with through hole formed therein, method for manufacturing the same and display panel" (Chinese Inventors)

US Patent Issued to TCL China Star Optoelectronics Technology on July 21 for "Array substrates and display panels" (Chinese Inventors)

US Patent Issued to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY on July 21 for "Display panel and display device" (Chinese Inventors)

US Patent Issued to INNOLUX on July 21 for "Electronic display device with horizontal connection electrode connecting power lines in peripheral region" (Taiwanese Inventors)