US Patent Issued to BOE TECHNOLOGY GROUP on July 21 for "Display substrate having interlayer insulation layer with through hole formed therein, method for manufacturing the same and display panel" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,267, issued on July 21, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing).

"Display substrate having interlayer insulation layer with through hole formed therein, method for manufacturing the same and display panel" was invented by Lizhong Wang (Beijing), Ce Ning (Beijing), Tianmin Zhou (Beijing), Jinchao Zhang (Beijing) and Liping Lei (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a display substrate, a method for manufacturing the display substrate and a display panel. The display substrate includes: a first semiconductor layer on a base substrate, where an active layer of the first thin film transist...