US Patent Issued to Imec vzw on July 21 for "Integrated circuit chips comprising forksheet devices connected with buried power rails" (Belgian Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,261, issued on July 21, was assigned to Imec vzw (Leuven, Belgium).

"Integrated circuit chips comprising forksheet devices connected with buried power rails" was invented by Boon Teik Chan (Wilsele, Belgium), Gaspard Hiblot (Leuven, Belgium) and Gioele Mirabelli (Leuven, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "Integrated circuit chips and method for making integrated circuit chips are provided. The method includes providing a semiconductor substrate, forming a device layer including a forksheet device on the substrate and providing the substrate with a substrate part of a dielectric wall of the forksheet device, a first shallow trench...