ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,152, issued on July 14, was assigned to Super Micro Computer Inc. (San Jose, Calif.). "Mesh inductors and antennas of electronic assemblies... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,153, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Sensor for thermal dissipation measurement" ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,154, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Jongg... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,155, issued on July 14, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and substrat... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,156, issued on July 14, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,157, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Etching-damage-free intermetal ... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,158, issued on July 14, was assigned to DENKA COMPANY Ltd. (Tokyo). "Heat dissipation member" was invented by Daisuke Goto (Tokyo) and Hiro... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,159, issued on July 14, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "3D integrated chips with microfluidic cooling... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,160, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and semiconductor devi... और पढ़ें
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,161, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Glass-based cavity and channels for cooling of embedded dies an... और पढ़ें