ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,049, issued on April 14, was assigned to Oerlikon Surface Solutions AG, Pfaffikon (Pfaffikon, Switzerland). "Ag- and/or Cu-containing hard... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,050, issued on April 14, was assigned to ENTEGRIS INC. (Billerica, Mass.). "Surface modified substrates and related methods" was invented ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,051, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Oxidation resistant protective layer in chamber conditioni... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,052, issued on April 14, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, substrate processing method, met... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,053, issued on April 14, was assigned to APPLIED MATERIALS Inc. (Santa Clara, Calif.). "Dog bone exhaust slit tunnel for processing chambe... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,054, issued on April 14, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Method for producing a gallium oxide semiconductor film and... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,055, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Method of depositing atomic layer" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,056, issued on April 14, was assigned to Centre National de la Recherche Scientifique (Paris), Universite de Lille (Lille, France), Central... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,057, issued on April 14, was assigned to Lam Research Corp. (Fremont, Calif.). "Soaking and ESC clamping sequence for high bow substrates"... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,058, issued on April 14, was assigned to Kokusai Electric Corp. (Tokyo). "Substrate processing apparatus, method of manufacturing semicond... Read More