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US Patent Issued to Applied Materials on July 14 for "Growth suppression deposition for CVD tungsten gap fill with thermal treatment" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,115, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Growth suppression deposition for CVD tungsten gap f... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING CMPANY on July 14 for "Local interconnect" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,116, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CMPANY LTD. (Hsinchu, Taiwan). "Local interconnect" was invented... Read More


US Patent Issued to UNITED MICROELECTRONICS on July 14 for "Semiconductor circuit pattern and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,117, issued on July 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor circuit pattern and manufactu... Read More


US Patent Issued to ASM IP Holding on July 14 for "Methods and systems for filling a gap" (Finnish, Belgian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,118, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods and systems for filling a gap" was invented by ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Reversed high aspect ratio contact (HARC) structure and process" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,119, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Reversed high aspect ratio contact (HARC) st... Read More


US Patent Issued to QUALCOMM on July 14 for "Self-aligned backside contact module for 3DIC application" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,120, issued on July 14, was assigned to QUALCOMM Inc. (San Diego). "Self-aligned backside contact module for 3DIC application" was invented... Read More


US Patent Issued to Intel on July 14 for "Gallium nitride (GaN) devices with through-silicon vias" (Oregon Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,121, issued on July 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Gallium nitride (GaN) devices with through-silicon vias" was in... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Via structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,122, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Via structure and method for fo... Read More


US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,123, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor device and method of fabric... Read More


US Patent Issued to Invention and Collaboration Laboratory on July 14 for "Memory array circuit" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,124, issued on July 14, was assigned to Invention and Collaboration Laboratory Inc. (Taipei City, Taiwan). "Memory array circuit" was inven... Read More