ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,078, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor process equipment" was invented by Bha... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,079, issued on July 14, was assigned to Persimmon Technologies Corp. (Wakefield, Mass.). "Modular material handling robot platform" was inv... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,080, issued on July 14, was assigned to Semes Co. Ltd (Cheonan-si, South Korea). "OHT management system and control method for OHT manageme... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,081, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Method for transporting wafers" was... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,082, issued on July 14, was assigned to SEMES Co. LTD. (Chungcheongnam-do, South Korea). "Crane device, driving method thereof, and stocker... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,083, issued on July 14, was assigned to Kioxia Corp. (Tokyo). "Cassette housing, prober, server rack, and storage system" was invented by T... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,084, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Dielectric spectroscopy temperature monitoring using... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,085, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Feature creation in substrate supports" was invented... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,086, issued on July 14, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo). "Temporary adhesion method, device wafer processing method, la... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,087, issued on July 14, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore). "Plasma diced wafers and methods thereof" was invented by ... Read More