ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,087, issued on July 14, was assigned to UTAC HEADQUARTERS PTE. LTD. (Singapore).
"Plasma diced wafers and methods thereof" was invented by Dzafir Bin Mohd Shariff (Singapore), Il Kwon Shim (Singapore), Enrique E. Sarile Jr. (Singapore), Jackson Fernandez Rosario (Singapore), Ronnie M. De Villa (Singapore) and Chan Loong Neo (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "Reliable plasma dicing of a wafer with a die attach film (DAF) to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. A combina...