US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on July 14 for "Method for transporting wafers" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,081, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan).

"Method for transporting wafers" was invented by Wei-Chih Chen (Taichung City, Taiwan), Shi-Chi Chen (Taichung City, Taiwan), Ting-Wei Wang (Taichung City, Taiwan), Jen-Ti Wang (Taichung City, Taiwan) and Kuo-Fong Chuang (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes moving a wafer transport device on a transport rail, wherein the wafer transport device comprises a hoist unit configured to grip a wafer container unit; stopping the wafer transport device above a load port; after stopping the wafer transport de...