ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,955, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Integrated circuit device and method of manu... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,956, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wet atomic layer etching method and method o... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,957, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and manufacturing... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,958, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structures and me... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,959, issued on Oct. 27, was assigned to ETRON TECHNOLOGY INC. (Hsinchu, Taiwan). "3D IC structure" was invented by Chao-Chun Lu (Hsinchu, T... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,960, issued on Oct. 27, was assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES LLC (Scottsdale, Ariz.). "Fan out package for a semiconductor p... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,961, issued on Oct. 27, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Electronic devices and methods of manufa... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,962, issued on Oct. 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Shielded lead package for high voltage devices" was invented by M... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,963, issued on Oct. 27, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package with stif... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,964, issued on Oct. 27, was assigned to STMicroelectronics International N.V. (Geneva). "Method for manufacturing several integrated circui... Read More