ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,957, issued on Oct. 27, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Package structure and manufacturing method thereof" was invented by Ming-Fa Chen (Taichung City, Taiwan), Hsien-Wei Chen (Hsinchu City, Taiwan), Jie Chen (New Taipei City, Taiwan), Sen-Bor Jan (Tainan City, Taiwan) and Sung-Feng Yeh (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure including at least one die laterally encapsulate by an encapsulant, a bonding film and an interconnect structure is provided. The bonding film is located on a first side of the encapsulant, and the bonding film includes a first alig...