ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,935, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and method of manufactu... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,936, issued on Oct. 27, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Stack package including insert die for reinforcement" was ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,937, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages" was invented by Tae-... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,938, issued on Oct. 27, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device" was invented by Yuki Yamamoto (Tokyo) and... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,939, issued on Oct. 27, was assigned to SK hynix Inc. (Gyeonggi-do, South Korea). "Semiconductor device and manufacturing method of semicon... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,940, issued on Oct. 27, was assigned to STATS ChipPAC Pte. Ltd. (Singapore). "Semiconductor device and method of selective shielding using ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,941, issued on Oct. 27, was assigned to STMICROELECTRONICS INTERNATIONAL N.V. (Geneva). "Wire bond electromagnetic interference (EMI) cage ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,942, issued on Oct. 27, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Chip package with tamper prevention" was invent... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,943, issued on Oct. 27, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Multi chip front end module with shielding vias" was inv... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,944, issued on Oct. 27, was assigned to Beijing BOE Technology Development Co. Ltd. (Beijing). "High integration substrate integrated with ... Read More