US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Semiconductor packages" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,937, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor packages" was invented by Tae-Ho Kang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package. The semiconductor package may comprise a first die, a second die on the first die, and connection terminals, the first die comprises: a first silicon substrate that has a lower side and an upper side opposite to the lower side, first through vias, first chip pads, and a first dummy pattern on the upper side of the first silicon substrate, the first dummy pattern having a grid shape from a plan view a...