ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,610, issued on Oct. 27. "Device for an electrical plug provided with a winding means" was invented by Patrice Kandin (Meyrargues, France). ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,611, issued on Oct. 27, was assigned to JILIN ZHONG YING HIGH TECHNOLOGY Co. LTD. (Changchun, China). "Wiring harness module and combined w... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,612, issued on Oct. 27, was assigned to AKTIEBOLAGET SKF (Gothenburg, Sweden). "Grounding brush assembly with brush fitting plate having to... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,613, issued on Oct. 27, was assigned to Amphenol Corp. (Wallingford, Conn.). "Method and apparatus for efficient manufacture of high perfor... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,614, issued on Oct. 27, was assigned to 1FINITY Inc. (Kawasaki, Japan). "Erbium doped fiber optical amplifier with adaptive filter" was inv... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,615, issued on Oct. 27, was assigned to Blue Laser Fusion Inc. (Palo Alto, Calif.). "Cavity dumper configured with an optical enhancement c... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,616, issued on Oct. 27, was assigned to Nuvoton Technology Corporation Japan (Kyoto, Japan). "Semiconductor light-emitting device and light... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,617, issued on Oct. 27, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Stem for semiconductor package and semiconduc... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,618, issued on Oct. 27, was assigned to ENNOSTAR Corp. (Hsinchu City, Taiwan). "Package structure" was invented by Meng Hsin Kuo (Hsinchu, ... Read More
ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,619, issued on Oct. 27, was assigned to Excelitas Canada Inc. (Vaudreuil-Dorion, Canada). "Semiconductor side emitting laser on board packa... Read More