US Patent Issued to Excelitas Canada on Oct. 27 for "Semiconductor side emitting laser on board package and method forming same" (Canadian, Philippine Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,619, issued on Oct. 27, was assigned to Excelitas Canada Inc. (Vaudreuil-Dorion, Canada).

"Semiconductor side emitting laser on board package and method forming same" was invented by JinHan Ju (Kirkland, Canada), Ralph Kig-I (Binan, Philippines), Frederic Laforce (Coteau-du-Lac, Canada) and Almar Palonpon (Laguna, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip-onboard assembly for a side-looking optical component is mounted on a mounting surface of a printed circuit board (PCB) and includes a window assembly mounted to the PCB. The window assembly includes a glass window and a window holding bracket. The bracket has a first walled...