US Patent Issued to ENNOSTAR on Oct. 27 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,618, issued on Oct. 27, was assigned to ENNOSTAR Corp. (Hsinchu City, Taiwan).

"Package structure" was invented by Meng Hsin Kuo (Hsinchu, Taiwan), Ming-Jing Lee (Hsinchu, Taiwan) and Yi-Min Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a substrate, a frame structure, and a lens portion. The frame structure is disposed on the substrate. A sidewall of the frame structure has multiple lamination traces thereon. The lens portion covers the substrate. The frame structure has a through hole passing through the sidewall, and the through hole includes an edge, and a port...