US Patent Issued to SHINKO ELECTRIC INDUSTRIES on Oct. 27 for "Stem for semiconductor package and semiconductor package" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,776,617, issued on Oct. 27, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).

"Stem for semiconductor package and semiconductor package" was invented by Masao Kainuma (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stem for a semiconductor package includes an eyelet including a flat plate having a first surface and a second surface opposite to the first surface, a cavity opening to the first surface of the flat plate, and a metal block protruding from the second surface of the flat plate, and a lead extending through the flat plate from the first surface to the second surface, wherein a volume of the metal block is sub...