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US Patent Issued to Advanced Semiconductor Engineering on April 7 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,043, issued on April 7, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device package and meth... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Display module and display device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,044, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module and display device" was inven... और पढ़ें


US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 7 for "Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,045, issued on April 7, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Sensor chips having columnar microstr... और पढ़ें


US Patent Issued to Samsung Display on April 7 for "Apparatus and method for fabricating display panel, and display panel" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,046, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Apparatus and method for fabricating display pa... और पढ़ें


US Patent Issued to VueReal on April 7 for "Optoelectronic microdevice" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,047, issued on April 7, was assigned to VueReal Inc. (Waterloo, Canada). "Optoelectronic microdevice" was invented by Gholamreza Chaji (Wat... और पढ़ें


US Patent Issued to Mitsubishi Electric on April 7 for "Semiconductor device comprising submodule having at least an upper surface exposed and method of manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,048, issued on April 7, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device comprising submodule having at least an up... और पढ़ें


US Patent Issued to NICHIA on April 7 for "Light-emitting device, integrated light-emitting device, and light-emitting module" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,049, issued on April 7, was assigned to NICHIA Corp. (Anan, Japan). "Light-emitting device, integrated light-emitting device, and light-emi... और पढ़ें


US Patent Issued to Intel on April 7 for "Multi-level die coupled with a substrate" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,050, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Multi-level die coupled with a substrate" was invented by Omkar... और पढ़ें


US Patent Issued to T-Mobile USA on April 7 for "Techniques for resource allocation improvement in a mobile network" (Virginia, Kansas, Washington Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,597, issued on April 7, was assigned to T-Mobile USA Inc. (Bellevue, Wash.). "Techniques for resource allocation improvement in a mobile ne... और पढ़ें


US Patent Issued to QUALCOMM on April 7 for "Scheduling for active bandwidth parts" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,598, issued on April 7, was assigned to QUALCOMM Inc. (San Diego). "Scheduling for active bandwidth parts" was invented by Ahmed Attia Abot... और पढ़ें