US Patent Issued to Mitsubishi Electric on April 7 for "Semiconductor device comprising submodule having at least an upper surface exposed and method of manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,048, issued on April 7, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Semiconductor device comprising submodule having at least an upper surface exposed and method of manufacturing the semiconductor device" was invented by Yosuke Nakata (Tokyo), Norikazu Sakai (Tokyo), Yuji Sato (Tokyo) and Yoshinori Yokoyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object is to provide a technique capable of easily taking out a submodule from a semiconductor device to reuse the submodule. The semiconductor device includes: a submodule in which a conductive plate and a semiconductor element mounted to an upper surface of the conductive plate vi...