US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 7 for "Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,045, issued on April 7, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereof" was invented by Chia-Shuai Chang (Hsin-Chu County, Taiwan), Wen-Fu Yu (Taipei City, Taiwan), Bae-Yinn Hwang (Taipei City, Taiwan), Wei-Li Wang (Taipei City, Taiwan) and Chien-Hung Lin (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a fixing adhesive layer disposed...