ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,050, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.).
"Multi-level die coupled with a substrate" was invented by Omkar Karhade (Chandler, Ariz.), Sai Vadlamani (Gilbert, Ariz.), Xavier F. Brun (Chandler, Ariz.) and Hemanth Dhavaleswarapu (Tempe, Ariz.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments described herein may be related to apparatuses, processes, and techniques related to multilevel dies, in particular to photonics integrated circuit dies with a thick portion and a thin portion, where the thick portion is placed within a cavity in a substrate and the thin portion serves as an overhang to physically couple wi...