ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,755, issued on Oct. 6, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto). "Semiconductor package having lead frame wi... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,756, issued on Oct. 6, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Package with low-warpage carrier" was invented by Abd... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,757, issued on Oct. 6, was assigned to PIERBURG GMBH (Neuss, Germany). "Power semiconductor package" was invented by Mika Nuotio (San Jose, ... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,758, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and manufacturi... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,759, issued on Oct. 6, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of manufacturing semicondu... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,760, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Asymmetrical dielectric-to-metal adhesion architecture for electr... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,761, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "TSV-type embedded multi-die interconnect bridge enabling with the... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,762, issued on Oct. 6, was assigned to Kioxia Corp. (Tokyo). "Wiring board, semiconductor device, and method for manufacturing semiconductor... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,763, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Cheol K... Read More
ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,764, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor package and manufacturi... Read More