US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on Oct. 6 for "Semiconductor package having lead frame with slanted sections" (American, Chinese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,755, issued on Oct. 6, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto).

"Semiconductor package having lead frame with slanted sections" was invented by Zhiqiang Niu (Santa Clara, Calif.), Xiao Zhang (Sunnyvale, Calif.), Long-Ching Wang (Cupertino, Calif.), Guobing Shen (Shanghai) and Yan Xun Xue (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises a lead frame, a chip, and a molding encapsulation. The lead frame comprises a top plate, a plurality of drain pads, a plurality of slanted sections, a gate pad, and a plurality of source pads. The top plate of the lead frame comprises a...