US Patent Issued to Infineon Technologies on Oct. 6 for "Package with low-warpage carrier" (Malaysian, German Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,756, issued on Oct. 6, was assigned to Infineon Technologies AG (Neubiberg, Germany).

"Package with low-warpage carrier" was invented by Abdul Rahman Mohamed (Muar, Malaysia), Shin Tieng Liew (Ipoh, Malaysia), Chiong Yong Tay (Tangkak, Malaysia), Lee Shuang Wang (Melaka, Malaysia), Edmund Jr. Banogon Selorio (Melaka, Malaysia) and Ingrid Maus (Regensburg, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a package is disclosed. In one example, the method comprises providing a carrier with at least one component mounting region for mounting at least one electronic component. The carrier is pre-warped in accordance with a...