US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Semiconductor package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,764, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and manufacturing method thereof" was invented by Tzuan-Horng Liu (Taoyuan City, Taiwan) and Hao-Yi Tsai (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first device die and a second device die; an encapsulant, laterally encapsulating the first and second device dies; a bridge die, electrically connected to the first and second device dies and establishing communication between the first and second ...