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US Patent Issued to Advanced Micro Devices on Oct. 6 for "Inverted memory stack" (California, Washington Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,735, issued on Oct. 6, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "Inverted memory stack" was invented by Gabriel Lo... Read More


US Patent Issued to OOKUMA DIAMOND DEVICE on Oct. 6 for "Field effect transistor" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,736, issued on Oct. 6, was assigned to OOKUMA DIAMOND DEVICE Inc. (Sapporo, Japan). "Field effect transistor" was invented by Junichi Kaneko... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Oct. 6 for "Shielding for reducing electromagnetic interference and magnetic interference and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,737, issued on Oct. 6, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Shielding for reducing electromagneti... Read More


US Patent Issued to NANYA TECHNOLOGY on Oct. 6 for "Semiconductor structure, semiconductor device with air spacers, and method for fabricating the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,738, issued on Oct. 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor structure, semiconductor device with... Read More


US Patent Issued to Intel on Oct. 6 for "Package substrate with open air gap structures" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,739, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Package substrate with open air gap structures" was invented by K... Read More


US Patent Issued to Intel on Oct. 6 for "Single layer and multilayer magnetic inductors between substrate cores" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,740, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.). "Single layer and multilayer magnetic inductors between substrate ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Method of manufacturing semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,741, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Method of manufacturing semiconductor device" ... Read More


US Patent Issued to NANYA TECHNOLOGY on Oct. 6 for "Memory device package having scribe line and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,742, issued on Oct. 6, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Memory device package having scribe line and metho... Read More


US Patent Issued to Littelfuse on Oct. 6 for "Press pack power semiconductor device with locator strip" (Illinois Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,743, issued on Oct. 6, was assigned to Littelfuse Inc. (Rosemont, Ill.). "Press pack power semiconductor device with locator strip" was inve... Read More


US Patent Issued to UNITED MICROELECTRONICS on Oct. 6 for "Semiconductor structure and alignment method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,744, issued on Oct. 6, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor structure and alignment method ... Read More