US Patent Issued to Intel on Oct. 6 for "Package substrate with open air gap structures" (Arizona Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,739, issued on Oct. 6, was assigned to Intel Corp. (Santa Clara, Calif.).

"Package substrate with open air gap structures" was invented by Kristof Kuwawi Darmawikarta (Chandler, Ariz.), Cemil S. Geyik (Gilbert, Ariz.), Kemal Aygun (Tempe, Ariz.), Tarek A. Ibrahim (Mesa, Ariz.), Wei-Lun Jen (Phoenix), Zhiguo Qian (Chandler, Ariz.) and Dilan Seneviratne (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of a microelectronic assembly that includes: a package substrate, comprising buildup layers of an organic dielectric material and a plurality of layers of conductive traces in the organic dielectric material, the package substrate havin...