ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,741, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Method of manufacturing semiconductor device" was invented by Jaeil Lee (Hwaseong-si, South Korea) and Kyoungcho Na (Hwaseong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes forming a first layer on a wafer through a single shot exposure, a single shot of the first layer including first overlay marks; forming a second layer and a first photoresist film on the first layer; and performing an upper shot exposure and a lower shot exposure onto the first photoresist film based on a first ove...