ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,629, issued on April 21, was assigned to ASML Netherlands B.V. (Veldhoven, Netherlands). "Charged-particle detector package for high speed... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,630, issued on April 21, was assigned to Sumitomo Electric Industries Ltd. (Osaka, Japan). "Method of manufacturing a light-receiving elem... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,631, issued on April 21, was assigned to HRL LABORATORIES LLC (Malibu, Calif.). "Magnetic curving of imaging sensors" was invented by Mark... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,632, issued on April 21, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China). "Semiconductor device and manuf... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,633, issued on April 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Image sensor with improved light ... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,634, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Image sensor" was invented by Jungwook Lim... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,635, issued on April 21, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "X-ray detection device" was invented by Minoru Ichi... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,636, issued on April 21, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Photoelectric sensor and substrate" was invented by Pen... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,637, issued on April 21, was assigned to BEIJING BOE SENSOR TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Te... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,638, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of manufa... Read More