US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on April 21 for "Semiconductor device and manufacturing method therefor, and chip bonding structure" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,632, issued on April 21, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Wuhan, China).

"Semiconductor device and manufacturing method therefor, and chip bonding structure" was invented by Tian Zeng (Wuhan, China), Di Zhan (Wuhan, China) and Tianjian Liu (Wuhan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes: providing bonded first and second wafers; forming a patterned insulating layer on the second substrate, the patterned insulating layer having first holes and dummy holes both exposing the second substrate; forming a protective layer, which fills a partial depth ...