US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 7 for "Sensor chips having columnar microstructures embedded and surrounded by adhesive layer in a package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,045, issued on April 7, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan). "Sensor chips having columnar microstr... Read More

US Patent Issued to Samsung Display on April 7 for "Apparatus and method for fabricating display panel, and display panel" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,046, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Apparatus and method for fabricating display pa... Read More

US Patent Issued to VueReal on April 7 for "Optoelectronic microdevice" (Canadian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,047, issued on April 7, was assigned to VueReal Inc. (Waterloo, Canada). "Optoelectronic microdevice" was invented by Gholamreza Chaji (Wat... Read More

US Patent Issued to Mitsubishi Electric on April 7 for "Semiconductor device comprising submodule having at least an upper surface exposed and method of manufacturing the semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,048, issued on April 7, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device comprising submodule having at least an up... Read More

US Patent Issued to NICHIA on April 7 for "Light-emitting device, integrated light-emitting device, and light-emitting module" (Japanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,049, issued on April 7, was assigned to NICHIA Corp. (Anan, Japan). "Light-emitting device, integrated light-emitting device, and light-emi... Read More

US Patent Issued to Intel on April 7 for "Multi-level die coupled with a substrate" (Arizona Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,050, issued on April 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Multi-level die coupled with a substrate" was invented by Omkar... Read More

US Patent Issued to T-Mobile USA on April 7 for "Techniques for resource allocation improvement in a mobile network" (Virginia, Kansas, Washington Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,597, issued on April 7, was assigned to T-Mobile USA Inc. (Bellevue, Wash.). "Techniques for resource allocation improvement in a mobile ne... Read More

US Patent Issued to QUALCOMM on April 7 for "Scheduling for active bandwidth parts" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,598, issued on April 7, was assigned to QUALCOMM Inc. (San Diego). "Scheduling for active bandwidth parts" was invented by Ahmed Attia Abot... Read More

US Patent Issued to LENOVO (BEIJING) on April 7 for "Methods and apparatus for semi-persistent scheduling (SPS) downlink transmission" (Chinese, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,599, issued on April 7, was assigned to LENOVO (BEIJING) Ltd. (Beijing). "Methods and apparatus for semi-persistent scheduling (SPS) downli... Read More

US Patent Issued to Nokia Solutions and Networks on April 7 for "Xapp conflict mitigation framework" (French, American Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,600, issued on April 7, was assigned to Nokia Solutions and Networks Oy (Espoo, Finland). "Xapp conflict mitigation framework" was invented... Read More

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