US Patent Issued to Samsung Display on April 7 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,035, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Jin Taek Park (... Read More

US Patent Issued to Arm on April 7 for "Circuit architecture in multi-dimensional monolithic structure" (Indian, French Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,036, issued on April 7, was assigned to Arm Ltd. (Cambridge, Great Britain). "Circuit architecture in multi-dimensional monolithic structur... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,037, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Song-... Read More

US Patent Issued to Samsung Display on April 7 for "Display device with a heat dissipation substrate and a cover substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,038, issued on April 7, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device with a heat dissipation substrat... Read More

US Patent Issued to SHENZHEN JUFEI OPTOELECTRONICS on April 7 for "LED chip module and method for manufacturing LED chip module" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,039, issued on April 7, was assigned to SHENZHEN JUFEI OPTOELECTRONICS Co. LTD (Shenzhen, China). "LED chip module and method for manufactu... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Three-dimensional integrated circuit structure and a method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,040, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Three-dimensional integrated circuit structu... Read More

US Patent Issued to Innolux on April 7 for "Communication device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,041, issued on April 7, was assigned to Innolux Corp. (Miaoli County, Taiwan). "Communication device and manufacturing method thereof" was ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Carrier structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,042, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Carrier structure and methods of fo... Read More

US Patent Issued to Advanced Semiconductor Engineering on April 7 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,043, issued on April 7, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor device package and meth... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Display module and display device" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,044, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module and display device" was inven... Read More

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