US Patent Issued to Hyundai Motor, Kia on April 7 for "Power module for vehicle" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,015, issued on April 7, was assigned to Hyundai Motor Co. (Seoul, South Korea) and Kia Corp. (Seoul, South Korea). "Power module for vehicl... Read More

US Patent Issued to Dell Products on April 7 for "Flip chip package" (Texas Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,016, issued on April 7, was assigned to Dell Products LP (Round Rock, Texas). "Flip chip package" was invented by Qinghong He (Austin, Texa... Read More

US Patent Issued to LG INNOTEK on April 7 for "Package substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Package substrate" was invented by Nam Heon Kim (Seoul, ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on April 7 for "Package structure with enhancement structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,018, issued on April 7, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure with enhancement ... Read More

US Patent Issued to Zhuhai ACCESS Semiconductor on April 7 for "Embedded packaging structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,019, issued on April 7, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd. (Guangdong, China). "Embedded packaging structure and manufact... Read More

US Patent Issued to Kulicke and Soffa Industries on April 7 for "Electronic component bonding machines, and methods of measuring a distance on such machines" (Pennsylvania Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,020, issued on April 7, was assigned to Kulicke and Soffa Industries Inc. (Fort Washington, Pa.). "Electronic component bonding machines, a... Read More

US Patent Issued to Altera on April 7 for "Homogenous die stacking with increased element density" (American, Indian Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,021, issued on April 7, was assigned to Altera Corp. (San Jose, Calif.). "Homogenous die stacking with increased element density" was inven... Read More

US Patent Issued to ASMPT SINGAPORE on April 7 for "Apparatus for applying a sintering force via a compressible film" (Singaporean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,022, issued on April 7, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Apparatus for applying a sintering force via a compressible... Read More

US Patent Issued to WINBOND ELECTRONICS on April 7 for "Semiconductor structure and method for forming the same and semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,023, issued on April 7, was assigned to WINBOND ELECTRONICS CORP. (Taichung City, Taiwan). "Semiconductor structure and method for forming ... Read More

US Patent Issued to Wuhan Tianma Micro-Electronics, Wuhan Tianma MicroElectronics Co. Ltd. Shanghai Branch on April 7 for "Display module and substrate thereof having improved binding reliability of substrate and flexible circuit board" (Chinese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,024, issued on April 7, was assigned to Wuhan Tianma Micro-Electronics Co. Ltd. (Wuhan, China) and Wuhan Tianma MicroElectronics Co. Ltd. Sh... Read More

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