US Patent Issued to Renesas Electronics on July 28 for "Semiconductor device and control system" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,774, issued on July 28, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and control system" was invented by Yoshim... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,775, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Seong... Read More

US Patent Issued to Intel on July 28 for "Glass substrate device with embedded components" (Arizona Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,776, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Glass substrate device with embedded components" was invented b... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package having redistribution structure" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,777, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package having redistribution ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package including connecting pads" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,778, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package including connectin... Read More

US Patent Issued to Semiconductor Manufacturing International (Shanghai), Semiconductor Manufacturing International (Beijing) on July 28 for "Packaging structure and packaging method" (Chinese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,779, issued on July 28, was assigned to Semiconductor Manufacturing International (Shanghai) Corp. (Shanghai) and Semiconductor Manufacturin... Read More

US Patent Issued to QUALCOMM on July 28 for "Package comprising a substrate with cavity and an integrated device with a step back side" (California Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,780, issued on July 28, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a substrate with cavity and an integrated device wit... Read More

US Patent Issued on July 28 for "Integrated package and method for making the same" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,781, issued on July 28. "Integrated package and method for making the same" was invented by ByungHyun Kwak (Incheon, South Korea). Accordi... Read More

US Patent Issued to Intel on July 28 for "Electrical traces on glass cores in integrated circuit packages and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,782, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.). "Electrical traces on glass cores in integrated circuit packages... Read More

US Patent Issued to ASMPT SINGAPORE on July 28 for "Handling a fragile substrate for interconnect bonding" (Singaporean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,783, issued on July 28, was assigned to ASMPT SINGAPORE PTE. LTD. (Singapore). "Handling a fragile substrate for interconnect bonding" was ... Read More

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