US Patent Issued to Intel on July 28 for "Electrical traces on glass cores in integrated circuit packages and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,782, issued on July 28, was assigned to Intel Corp. (Santa Clara, Calif.).

"Electrical traces on glass cores in integrated circuit packages and methods of manufacturing the same" was invented by Kristof Darmawikarta (Chandler, Ariz.), Haobo Chen (Chandler, Ariz.), Xiaoying Guo (Chandler, Ariz.) and Hongxia Feng (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods, apparatus, systems, and articles of manufacture are disclosed to enable electrical traces on glass cores in integrated circuit packages that includes an integrated circuit (IC) package substrate comprising a glass core, a photo-imageable dielectric (PID) material on the ...