US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package having redistribution structure" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,777, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package having redistribution structure" was invented by Okseon Yoon (Suwon-si, South Korea), Jiyeong Kim (Cheonan-si, South Korea) and Jinyoung Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a redistribution structure including a plurality of redistribution insulation layers, which are stacked, a plurality of redistribution line patterns on an upper surface and a lower surface of the plurality of redistribution insulation layers, and constituting a plurality of distribution layers ...