US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package including connecting pads" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,778, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package including connecting pads" was invented by Yae Jung Yoon (Hwaseong-si, South Korea), Eung Kyu Kim (Yongin-si, South Korea), Min Jun Bae (Hwaseong-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea), Seok Hyun Lee (Hwaseong-si, South Korea) and Jae Gwon Jang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a passivation film, a mold layer on the passivation film, a connecting pad having a T shape, the T shape including a first portion and a second portion on the first po...